Corning Turns to HPCNY for Advanced Simulation Expertise

In Corning’s red-hot glass melting tanks in 1890, a team of two craftsman could blow two glass ‘bulb envelopes’ per minute; in 1925 one of those glassblowers, William Woods, invented the ‘Ribbon Machine,’ which poured a ribbon of molten glass down a chain with holes opening into molds, increasing the manufacturing rate fivefold. With early runs of 400,000 bulbs per day, this innovation would begin to light the world. For Corning R&D has always been the window to its future: leading to new materials, technologies and products, new applications for existing materials, and solutions to manufacturing problems that prevent technologies from reaching the market on a massive scale. Corning is still innovating with molten glass, but today their ‘Innovation Process’ involves a singular combination of the country’s most advanced fluid dynamics expertise, parallel computer systems, and advanced software solutions. With RPI, CCI and HPCNY, Corning is working to define accelerated simulation-based engineering systems to improve the fidelity of future materials and products, to reduce energy and raw material usage, and to make them more cost-effective and environmentally sustainable.tseFlowAndMesh2

According to Charles R. Craig, Senior Vice President of Administration and Operations at Corning, “For the past three years our engineers and researchers have collaborated with the HPCNY consortium to solve complex engineering problems that were previously beyond our reach. The HPCNY interactions reinforced the technical and business incentives for the application of high performance computing within Corning.

A direct result of this is Corning’s membership agreement with Rensselaer Polytechnic Institute’s Center for Computational Innovations (CCI) for supercomputer use and the assistance of computational scientists for development of advanced workflows.

The multi-faceted interactions are simultaneously extending current simulation based engineering capabilities while developing advanced capabilities suitable for next-generation high performance computing hardware. These efforts increase our competitiveness in the marketplace both now, and in the future.”

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